Intel’s groundbreaking glass substrate technology is set to revolutionize the world of computer processors, according to industry experts. The new technology, developed in collaboration with the display industry, offers increased efficiency, power, and real estate for processors, allowing for the integration of multiple “chiplets” into a single unit.
One of the main advantages of glass substrates is their ability to sustain Moore’s Law, which aims to fit more transistors into a processor. With the use of glass substrates, Intel can achieve this goal, giving them a competitive advantage over their competitors.
The advantages of glass substrates are numerous. They provide increased power and data connections, reduced warping, and improved thermal capabilities. This means that consumers can expect supercharged laptops and smarter AI tools in the near future.
Intel is leading the charge in transitioning the chip industry to glass substrates. This technology will first be used for large, power-hungry chips in data centers before being implemented in consumer applications.
The development of this glass substrate technology is part of Intel’s four-year recovery effort to regain its manufacturing prowess and catch up to competitors like TSMC and Samsung. Packaging and glass substrates play a critical role in attaching chips to circuit boards and enabling the integration of chiplets.
Other companies in the industry, such as Apple and AMD, have also embraced chiplet-based designs. Glass substrates will enable the creation of more complex and interconnected chiplet-based processors, particularly for server and AI applications.
Overall, Intel’s glass substrate technology is set to transform the chip industry and pave the way for more advanced and powerful processors. With the ability to integrate multiple chiplets into a single unit, consumers can look forward to faster and more efficient devices in the near future.
